Webinar: Control of wetting agents in electroplating applications - Practical use of tensiometers for electrolyte measurement
On Tuesday December 14th, SITA will hold another of their popular webinar series on the use of wetting agents in electroplating processes. Registration is free, so join today to learn some valuable insight into best practice and see some practical examples. See below for a rundown of content.
In many electroplating processes, surfactants are used to specifically improve the wetting behaviour on the parts, to avoid spray mist, or to regulate foam formation.
A measure of the surfactant content and therefore an essential process parameter is the dynamic surface tension. In order to adjust and control it, SITA bubble pressure tensiometers have been in use worldwide for many years.
In the online seminar "Control of wetting agents in electroplating applications - Practical use of tensiometers for electrolyte measurement" we introduce the dynamic surface tension and its measurement, explain the different SITA tensiometers and present several examples from electroplating and semiconductor technology.
- What has to be considered during the measurement?
- How are samples to be handled?
- What do the results mean?
With the help of illustrative examples, we will explain how parameters are determined in preliminary tests and how the curves and measured values obtained are interpreted. We also give an insight into analysis software ProcessLog and LabSolution.
The webinar commences at 11:00 EST and will last for 90 minutes. Registration is free and can be completed here. We look forward to joining you!